Tengli PCB shipping standard
Plate | 建滔/国纪 | 建滔/生益 |
Mechanical drilling |
PTH aperture tolerance ±0.075mm NPTH aperture tolerance +/-0.05mm Hole wall roughness ≤25μm |
PTH aperture tolerance ±0.075mm NPTH aperture tolerance +/-0.05mm Hole wall roughness ≤20μm |
Line |
Allow complement, +/-4MIL for counterpoint accuracy |
No line filling is allowed, and match accuracy is +/-3MIL |
Electroplating | Average hole copper 20μm, copper plating ductility ≥15% | Average pore copper 25μm, copper plating ductility ≥20% |
Solderproof |
Offset +/-3.0mi Guangxin ink, ink thickness 8μm |
Deviation degree+/-2.0mil Guangxin ink/Sun ink, ink thickness 10-15μm |
Contour accuracy tolerance | ±0.13mm | ±0.10MM(±0.05mm laser cutting can be specified) |
The finished copper surface is thick | 1oz≥32μm,2oz≥63μm,3oz≥98μm | 1oz≥35μm,2oz≥70μm,3oz≥105μm(Assignable maximum≤10oz) |
Fire rating |
UL Safety regulation:94V0 (After two 10-second combustion tests on the sample, the flame was extinguished within 10 seconds) |
UL Safety regulation:94V0 (After two 10-second combustion tests on the sample, the flame was extinguished within 10 seconds) |
On-off test | Custom test rack test /100% fly needle full test |
Customized test rack test /100% fly needle full test/four line low resistance fly test (Level III acceptance criteria may include this, but it is not required to be included) |
Warping degree | ≤0.75% | ≤0.5% |
packing | Plain packaging/vacuum packaging + desiccant | Vacuum packaging + desiccant + humidity card + partition paper |
Shipping report | Shipping report | According to product design features: shipment report, test report, impedance report, with impedance strip |
Physical experiment |
Solder weldability: wet area is greater than 95%, plating through hole is completely wet Thermal shock reliability: 288+/-5°10 seconds 3 times |
Solder weldability: wet area is greater than 95%, plating through hole is completely wet Thermal shock reliability: 288+/-5°10 seconds 3 times |
Acceptance criteria are optional | IPC-A-600J II | IPC-A-600J III |