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News > What is the impact of 5G era on PCB multilayer board development?

What is the impact of 5G era on PCB multilayer board development?

2023
04/03
This article is from
Tengli

Since its birth, 5G technology has always been a topic of close attention. Since the beginning of the 20th century, 5G has become popular and the Internet of Everything era has arrived, which is undoubtedly a new opportunity for all walks of life, especially for the electronics industry, which is a crucial development opportunity.

The development of 5G promotes the construction of large-scale data centers, which means that a large number of high-end PCB communication boards will be needed to support the huge traffic carried by data center servers, so the requirements for the number of layers and materials of PCB multi-layer circuit boards will be increasingly high. There is no doubt that the development of 5G drives PCB multilayer board to the direction of high precision and more complex.

PCB multilayer board is the general name of more than two layers of circuit board, composed of several layers of insulating substrate on the connecting wire and assembly welding electronic components of the welding plate, not only has the conduction of each layer of lines, but also has the role of mutual insulation. They are much more difficult to process than single and double panels and require higher quality and reliability. They are mainly used in communication equipment, high-end servers, medical electronics, aviation, industrial control, military and other fields.

From different angles, the influence of 5G on PCB multilayer board is as follows:

1. From the perspective of the construction of a single base station, due to the characteristics of 5G with high frequency and high speed, the value of the communication circuit board will be greatly improved, and the added value of the multilayer board will be increased.

2. From the perspective of the number of 5G base stations, the number of 5G base stations will be much more than that of 4G base stations, especially a certain number of micro base stations will be covered in the blind spot area, and the demand for circuit boards will be more.

3. From the perspective of 5G technology, the increase of 5G channels will lead to higher requirements for the area and number of layers of single PCB multilayer board, higher requirements for the performance of the board, and higher production costs.


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